|Size Chart for Cable Kits|
|Product Code||Output (Watts)||Cable Length (meters)||Ideal Room Coverage|
|TPC150||150 w||15 m||1 - 1.2 sqm|
|TPC250||250 w||25 m||1.3 - 2 sqm|
|TPC350||350 w||35 m||2.1 - 2.8 sqm|
|TPC450||450 w||45 m||2.9 - 3.5 sqm|
|TPC550||550 w||55 m||3.6 - 4.1 sqm|
|TPC650||650 w||65 m||4.2 - 4.8 sqm|
|TPC750||750 w||75 m||4.9 - 5.8 sqm|
|TPC900||900 w||90 m||5.9 - 6.9 sqm|
|TPC1100||1100 w||110 m||7.0 - 9.0 sqm|
|TPC1300||1300 w||130 m||8.0 - 10.0 sqm|
|TPC1500||1500 w||150 m||9.5 - 11.5 sqm|
|TPC1800||1800 w||180 m||11.6 - 13.5 sqm|
|TPC2000||2000 w||110 m + 90 m||13.0 - 15.0 sqm|
|TPC2200||2200 w||2 x 110 m||14.0 - 17.0 sqm|
|TPC2400||2400 w||130 m + 110 m||16.0 - 19.0 sqm|
|TPC2600||2600 w||2 x 130 m||17.0 - 20 sqm|
|TPC2800||2800 w||150 m + 130 m||18.5 - 22.0 sqm|
|TPC3000||3000 w||2 x 150 m||20.0 - 23.0 sqm|
|TPC3300||3300 w||180 m + 150 m||22.0 - 26.0 sqm|
In order to select the correct cable kit size to go with your Varme Loose Lay System you must first measure the free floor area of the room.
Note: When calculating the size, please remember to exclude the area taken up by any fixed objects such as baths, showers, kitchen units etc. You then need to multiply this area by 155 and choose the cable that falls as close to this number as possible, this will then fit into your Varme Loose Lay system.
For larger areas than those detailed on the chart please contact us for further information as these areas have a different electrical installation than standard sizes.
Hassle free tiling on green or cracked screeds. The Loose Lay System is designed to provide underfloor heating and fast track preparation for cracked
concrete substrates, chip board floors and green screeds that have not fully cured. The
matting absorbs lateral movement resulting in a crack free tiled floor.
If your substrate is not compatible with cement
based flexible tile adhesive it is possible to
adhere the loose lay system to the substrate using an
acrylic based emulsion adhesive. Check adhesive
manufacturer’s guidelines on correct substrate
preparation to ensure a strong bond is achieved.